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● 低CTE，高模量，可有效降低封装基板的翘曲
● 优异的耐湿热性
● 良好的PCB加工性
● 无卤材料
●较高的玻璃化转换温度
| Items | Condition | Unit | SI10U | SI10U LC |
|---|---|---|---|---|
| Tg | DMA | ℃ | 270 | 270 |
| Td | 5% wt. loss | ℃ | ＞400 | ＞400 |
| T300 | TMA | min | ＞60 | ＞60 |
| CTE (X/Y-axis) | Before Tg | ppm/℃ | 10 | 7 |
| Dissipation Constant (1GHz) | 2.5.5.9 | - | 4.6 | 4.2 |
| Dissipation Factor (1GHz) | 2.5.5.9 | - | 0.006 | 0.006 |
| Peel Strength | 12 um LP | N/mm | 0.8 | 0.8 |
| Flexural Modulus | A | GPa | 30 | 32 |
| Water Absorption | C-168/85/85 | % | 0.35 | 0.35 |
| Flammability | UL-94 | Rating | V-0 | V-0 |
| Heat Resistance | 300℃/solder dip | s | ＞300 | ＞300 |
| Heat Resistance after Moisture absorption | PCT 5h+288℃solder 20s | - | Pass | Pass |
| Halogen free | - | - | Yes | Yes |
| Glass | - | - | E glass | Low CTE-glass |